Aiming to meet the growing demand for on-device AI, Samsung Electronics has begun mass production of the industry’s thinnest dynamic random access (DRAM) low-power memory chips.
Samsung said it is producing the chips in 12-nanometer (nm) class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages. The devices are as thin as a fingernail, and this is an example of how AI is driving demand for new types of electronics.
By leveraging its expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space inside mobile devices, facilitating better airflow. It supports easy thermal control, a factor that is becoming increasingly important, especially for high-performance applications with advanced features such as on-device AI.
“Samsung’s LPDDR5X DRAM sets a new standard for on-device AI solutions, offering not only high LPDDR performance but in an ultra-compact package,” said YongCheol Bae, EVP of Memory Product Planning at Samsung Electronics. Also offers advanced thermal management.” “We are committed to continuous innovation through close collaboration with our customers, providing solutions that meet the future needs of the low-power DRAM market,” in a statement.
With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, with approximately 9% less thickness and nearly 9% better heat resistance than the previous generation product. Improves by 21.2%.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), which is smaller than existing LPDDR DRAM of 12GB or higher. is the thinnest. Samsung’s optimized back lapping3 process is also used to reduce package height.
Samsung plans to continue to expand the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in small package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules in the thinnest LPDDR DRAM packages for future devices. intends to
Credit : venturebeat.com